Archive for Industry News

Winbond SpiStack

Winbond Electronics Corporation, a leading global supplier of semiconductor memory solutions, today announced a dramatic expansion of its flash product portfolio with the introduction of a family of stackable SpiFlash® memories. The new SpiStack® W25M Series is Winbond’s first to allow the “stacking” of homogeneous or heterogeneous flash, thus achieving memories of varying densities for code and/or data storage, while providing designers with the flash solutions most appropriate for their design requirements.

The W25M Series provides a wide range of densities in the well-established 8-pin package to which designers are accustomed. Additionally, W25M memories feature the popular, multi-IO SpiFlash interface and command set.

“Stacking memories, both homogeneously and heterogeneously, is a revolutionary method of creating optimal memory solutions,” said Mike Chen, Director of Technical Marketing at Winbond Electronics Corporation America. “Winbond developed the SpiStack architecture to give designers maximum flexibility in tailoring flash solutions to meet their specific memory-density and -application requirements.”

SpiStack homogeneous memories are achieved by stacking SpiFlash dies – for example, two 256Mb dies combining to form a single SpiFlash 512Mb NOR memory — in the industry-standard 8-pin 8x6mm WSON package. This stacked product, W25M512JV, is also available in the widely used 16-pin SOIC or 24-pad BGA packages and is sampling now. SpiStack heterogeneous memories call for the stacking of a NOR memory with a NAND die, such as a 64Mb SpiFlash NOR blended with a 1Gb Serial NAND die, which gives designers the flexibility to store code in the NOR die and data in the NAND memory.

SpiStack highlights:

  • Multiple SpiFlash dies, each with density ranging from 16Mb to 2Gb, can be stacked with any combination of NOR and NAND dies.
  • Each die can be used according to its specifically beneficial characteristics. A NOR die can be used to store the boot code, thanks to its cell characteristics that deliver better endurance and retention, and fast random access time. A NAND memory can be used to store data and/or to back up the boot code.
  • A NAND die can also be used to upload the working memory data quickly whenever the system power goes down, thanks to its programming time that’s much faster than NOR. It improves the system quality by storing up-to-date code residing in the working memory for later usage.
  • SpiStack supports concurrent operation so that code execution is not interrupted for data updates.
  • All SpiStack features are supported in an 8-pin package along with the standard QSPI command, so that backward compatibility is conserved. This is done with the addition of a simple software die select instruction (C2h) and a factory-assigned die ID number. The dies are stacked based on Winbond’s unique stacking process technology.

To ensure satisfying the growing global demand for high-volume solutions, Winbond SpiFlash memories are manufactured in the company’s 12-inch wafer fabrication facility in Taichung, Taiwan.

Winbond SpiStack flash memory solutions are currently in production. For specific combination of densities required and for pricing on these products, please contact us at ecsrep@ecsrep.com.

PUI Audio is “eXcited” to announce an expansion to their line of Audio Sound eXciters!

PUI Audio is “eXcited” to announce an expansion to their line of audio sound eXciters. PUI Audio’s all-new large, high output Sound eXciters are designed for applications that demand loud sound with high fidelity, while remaining completely hidden.

The ASX05404-HD-R and ASX05408-HD-R can produce sound which rivals high fidelity floor standing speakers, in a 54 mm diameter package with 40 watt max power handling! An integrated M4 thread allows for easy mounting bracket attachment to reinforce the 3M™ VHB™ double-sided tape. Available in 4 and 8 ohm versions. The ASX08604-SW-R subwoofer eXciter has a 50W max power handling and is designed for subsonic and tactile applications, replacing an 8” subwoofer in a one cubic foot enclosure (or larger). Frequency response extends to below 20 Hz and an integrated mounting plate facilitates mechanical connection. The ASX08804-TP-R and ASX08808-TP-R feature 20W max power handling and are purpose-built for use in applications with high SPL requirements. A unique tripod frame design allows for extended excursion, creating great bass output, and the 3M™ VHB™ mounts can be bracket-reinforced using the M3 threads. The ASX10104-SPD-R or ASX10108-SPD-R spider eXciters feature Four support arms, with peel-and-stick 3M™ VHB™ pads for quick attachment, to allow for maximum movement and superior bass. Spring-loaded push terminals make amplifier wire connections a breeze. An integrated M3 thread allows for mechanical mounting to create even more structural rigidity, while the 30W max power handling supports even the largest application.

For more information about PUI Audio and their products contact us at ecsrep@ecsrep.com

New pushbuttons with fully illuminated plunger – FP 26 mm series

APEM complements its range of large illuminated pushbuttons with a dia. 26 mm series featuring snap-in mounting for easy installation.

The FP range also includes:

– FP 24 mm models, mounted by threaded bushing and sealed to IP69K
– FP 30 mm models, mounted by threaded bushing or snap-in, with gloss finish – chrome plated version available.

The whole FP range, combining attractive design and robustness, is ideal for applications including tractors, buses, trucks, cranes and automotive.

FP PDF catalog

Request more information

APEM company profile and history

Since its creation in 1952, APEM has become one of the leading worldwide manufacturers of man-machine interfaces. The group is present in 11 countries and has a network of more than 130 distributors and agents on five continents. With production plants in Europe, North Africa, America and Asia, APEM achieves 67 % of its turnover from export markets.

APEM develops and manufactures professional switch products for diversified markets including instrumentation, medical, communications, industrial automation, defense and transport. The APEM group supplies more than 20,000 customers worldwide.

History:

    • APEM was created in 1952 in Montpezat de Quercy (Tarn et Garonne) for the manufacture of industrial switches.
    • In 1971, a new manufacturing Plant was built, specialized in miniature switches.
    • In 1975, the Company began a strategy of international development and successively has created 3 subsidiaries in Europe and Tunisia :
      1. – Germany : 1975
      2. – United Kingdom and Tunisia : 1983
      3. – Benelux : 1989
    • In 1984, APEM opened a new plant specialized in the production of switch panels to complement its product range.
    • In 1991, it purchased American Switch Corp. in Boston (USA) and created a subsidiary, APEM COMPONENTS Inc, to achieve a solid presence on the North- American market. This year, the swedish subsidiary was also created.
    • In 1998, 1999 and 2000, APEM acquired companies presenting high commercial or technical interest :
      1. – MEC, a Danish manufacturer of high performance PCB tact switches,
      2. – WUJIN, near Shanghai, to create APEM (Wujin) Electronic, the Chinese subsidiary and operational base for APEM’s expansion into the Pacific Rim,
      3. – UNIFAB, in the USA, to expand its switch panel range.
    • In 2000, APEM created a new subsidiary in Mexico, APEM Mexico.
    • In 2002, APEM acquired a company producing stainless steel keyboards in Italy, which was given the name APEM Italia.
    • In 2005, APEM acquired OLIVER CONTROL SYSTEMS Ltd. in England, thus extending its offering with a wide range of panel mount industrial joysticks.
    • In 2008, acquisition of CH Products, USA, a leading manufacturer of joysticks, trackballs and simulation control devices